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Semiconductor Grade Quartz

Semiconductor Grade Quartz

-- Steady & Reliable Manufacturer --

Introduction to Ultra-High Purity Semiconductor Grade Quartz

Semiconductor grade quartz, also known as high-purity fused silica, is arguably the most critical auxiliary material in front-end silicon wafer processing. This material is not merely quartz; it is a meticulously synthesized or purified form of silicon dioxide (SiO2​) with metallic impurity levels measured in parts per billion (ppb) or parts per trillion (ppt). Its unique combination of properties—extreme thermal stability, high-temperature resistance, chemical inertness, and low hydroxyl (OH) content—makes it indispensable for handling silicon wafers during processes like diffusion, oxidation, epitaxy, and etching. Any trace contamination from the processware can severely compromise device yield and electrical performance. We specialize in providing a full suite of semiconductor quartz components, including quartz tubes, boats, crucibles, bells, injector nozzles, and various custom-machined parts used inside vertical and horizontal furnaces, as well as plasma chambers. Our materials meet the stringent requirements of the Semiconductor Equipment and Materials International (SEMI) standards, ensuring complete compatibility with 200mm and 300mm wafer fabrication tools. The material’s ability to withstand temperatures exceeding 1200∘C while resisting corrosive gases like chlorine and hydrogen is non-negotiable. The integrity of the semiconductor device hinges on the purity and reliability of the quartz components used throughout the thermal processing sequence. Our manufacturing facilities incorporate dedicated cleanrooms and specialized acid etching processes to achieve and maintain the ultra-high purity required before final packaging. We manage stress and structural integrity through advanced annealing cycles, ensuring complex assemblies like injector tubes and wafer boats withstand repeated, rapid thermal cycling without warping or cracking. Our commitment extends beyond raw material purity to include surface quality control, minimizing particle generation which is a primary source of defects in photolithography and deposition steps. The entire supply chain is rigorously controlled to prevent cross-contamination, solidifying our position as a trusted supplier in a zero-tolerance industry. Our engineering support includes materials selection consultation based on specific process chemistry (e.g., wet etch vs. dry etch) to optimize component lifespan and performance, directly contributing to our clients' high manufacturing yields.

SEMI Standard Specifications and Trace Element Limits

The definition of semiconductor grade quartz is governed by its chemical purity, thermal behavior, and adherence to extremely tight dimensional tolerances. The following table highlights critical parameters necessary for front-end fabrication processes.

Parameter Critical Requirement (SEMI Grade) Value/Limit Tolerance/Remark
SiO2​ Purity Ultra-High Purity ≥99.999% Required for 300mm and advanced nodes.
Trace Metal Impurities Total Alkali Metals (Na,K,Li) <20ppb (parts per billion) Impurities cause silicon contamination (dopants).
OH (Hydroxyl) Content Low Hydroxyl Type <10ppm to 50ppm Affects viscosity and devitrification rate.
Softening Point High Thermal Resistance Approx. 1650∘C Ensures stability during 1200∘C processes.
Devitrification Rate High Resistance Controlled by surface treatment/etching. Prevents particle shedding.
Dimensional Tolerance (Machined Parts) Micro-Precision ±0.05mm to ±0.1mm Essential for automated wafer handling.
Thermal Expansion Coefficient Extremely Low 5.5×10−7/∘C Guarantees dimensional stability during rapid cooling/heating.
Surface Finish Acid Etched/Flame Polished Ra (Roughness average) <0.1μm Minimizes particle adhesion and generation.

Trace metal content, particularly Na,K,Fe, and Al, is the most critical purity specification. Even miniscule amounts of these elements can diffuse into the silicon wafer at high temperatures, altering the electrical properties and causing device failure. Our certification includes ICP-MS (Inductively Coupled Plasma Mass Spectrometry) reports for every batch of semiconductor components, verifying ppb-level compliance. The low OH content is crucial because high OH content increases the rate of devitrification (crystallization of quartz), leading to surface roughness and particle shedding. For demanding epitaxy and LPCVD (Low-Pressure Chemical Vapor Deposition) processes, we recommend quartz with the lowest possible OH content and a final acid-etch cleaning which chemically removes surface damage and contaminants introduced during mechanical grinding. The dimensional tolerance must be absolutely precise to ensure compatibility with automatic boat loaders and robotic arms operating within the furnace. We work closely with our clients’ tool maintenance teams to ensure all our components, from simple carriers to complex gas injectors, fit seamlessly and perform reliably within the strict operational parameters of their multi-million dollar equipment. The rigorous process control we apply to our manufacturing, including pre-use cleaning procedures, is what defines our true semiconductor grade offering.

Process Applications in Wafer Fabrication

Semiconductor quartz components are utilized at almost every stage of high-temperature thermal processing within the integrated circuit (IC) manufacturing flow.

  • Thermal Furnace Processes (Horizontal and Vertical Furnaces):
    • Diffusion Tubes and Liners: Used as the inner wall of the furnace, creating a clean, high-temperature reaction zone for processes like Boron or Phosphorus diffusion.
    • Wafer Boats and Sleds: Carriers that hold 25 to 150 wafers during high-temperature steps (oxidation, annealing).
    • Baffles and Pedestals: Components that control gas flow dynamics and temperature uniformity inside the process chamber.
  • CVD/Epitaxy Equipment:
    • Bell Jars and Quartz Reactor Housings: Creating the reaction chamber for depositing thin films (e.g., polysilicon, silicon nitride).
    • Gas Injector Nozzles/Manifolds: Directing process gases with high precision onto the wafer surface.
  • Etch and Plasma Equipment:
    • Viewport Windows: Allowing visual or optical inspection of the plasma etching process while sealing the high-vacuum chamber.
    • Plasma Etch Shields/Focus Rings: Used as protective liners within the chamber due to their resistance to aggressive fluorine and chlorine plasma chemistries.
  • Cleaning and Wet Stations:
    • Quartz Tanks and Heaters: Used for holding and heating ultra-high-purity acids (e.g., SC−1,SC−2 cleans) due to quartz's superior acid resistance compared to plastics or metals.

The components must survive extreme thermal stress (rapid heating/cooling), corrosive chemical attack, and high vacuum, often simultaneously. For instance, a CVD bell jar must maintain perfect sealing while being exposed to both high heat and reactive precursor gases. Our deep understanding of wafer fabrication chemistry allows us to recommend the correct quartz type and surface preparation (e.g., flame-polished for high-vacuum sealing vs. acid-etched for particle control) for each specific process tool, maximizing component lifetime and reducing costly interruptions to the manufacturing line. This application-specific engineering ensures long-term performance stability in high-throughput cleanroom environments.

Key Performance and Reliability Advantages

The performance of our semiconductor-grade quartz is optimized to increase yield, reduce downtime, and lower the overall cost of ownership for wafer manufacturers.

  • Guaranteed Ultra-Low Contamination: Strict control over raw material sourcing and manufacturing environment ensures our components have the lowest possible metallic impurity levels (verified by ICP-MS), preventing the diffusion of contaminants into sensitive silicon wafers and maximizing device yield.
  • Exceptional Thermal Stability and Creep Resistance: Optimized annealing processes provide superior mechanical integrity, ensuring complex structures like 300mm wafer boats do not warp or sag under 1200∘C loads over hundreds of thermal cycles, maintaining crucial wafer spacing uniformity.
  • Outstanding Chemical Resistance: Fused silica resists nearly all process chemicals, including hot concentrated acids and aggressive plasma species, offering superior longevity compared to ceramic or glass alternatives in harsh etching and cleaning applications.
  • Minimized Particle Generation: Our proprietary final cleaning and surface treatments (acid etching and hydrofluoric acid passivation) eliminate microscopic surface flaws, greatly reducing the potential for particle shedding—a major cause of defects in advanced semiconductor nodes.
  • Precision Dimensional Accuracy: Components are manufactured to tight micron-level tolerances, guaranteeing perfect compatibility with highly automated furnace loading systems and ensuring smooth, reliable wafer transfer without jamming or breakage.
  • Fast Response to Custom Requirements: We maintain rapid prototyping and manufacturing capabilities for highly customized gas delivery systems and legacy equipment parts, minimizing the lead time for critical, non-standard component replacements.
  • Full Traceability and Certification: Every batch is traceable back to the raw material source and comes with comprehensive quality documentation, including Certificates of Analysis (CoA) for purity and Certificates of Conformance (CoC) for dimensions, meeting mandatory ISO and SEMI compliance requirements.

Our advantage is the seamless integration of material science, cleanroom fabrication, and application expertise, delivering components that are designed to endure the unrelenting demands of the semiconductor fabrication environment.

Procurement, Payment Terms, and Global Logistics

Given the high value and critical nature of semiconductor components, our trade terms prioritize security, transparency, and reliable global delivery.

  • Payment Structures: We operate on secure international payment methods. Typically, we require a 30% deposit (T/T) upon Purchase Order confirmation to initiate custom fabrication and material allocation. The remaining 70% balance is due upon successful Pre-Shipment Inspection (PSI) and prior to dispatch. For established, high-volume clients, we may offer Net 30/60 terms following a formal credit approval process. We support multi-currency transactions, primarily USD.
  • Cleanroom Packaging: All semiconductor components are subject to strict cleanliness standards. After the final acid clean, parts are packaged in triple-sealed, nitrogen-purged, cleanroom-compatible barrier bags, which are then protected by static-dissipative foam inserts and housed in customized, heavy-duty wooden crates or flight cases. Each part is labeled with its serial number and certified clean status.
  • Shipping Logistics: Due to the high value and urgency in the semiconductor industry, air freight is the standard mode of transport. We ship globally using premium express carriers (e.g., FedEx Priority, DHL Express) under CIP (Carriage and Insurance Paid To) or DDP (Delivered Duty Paid) terms to minimize customs delays for the end-user. We manage all export documentation and trade compliance.
  • Manufacturing Lead Time: Complex quartz assemblies (e.g., bell jars, large boats) have a typical lead time of 4-8 weeks, depending on complexity and the current tool load. Standard consumable items like tubes and plates may ship faster. We offer an 'AOG' (Aircraft on Ground) expedited service for critical, tool-down emergencies, reducing lead times where possible.
  • Warranty and Assurance: We provide a warranty covering material purity and dimensional compliance as per the agreed-upon technical drawings. Our strict PSI ensures dimensional accuracy. Any claims must be supported by receiving inspection reports and documentation within a short period of delivery, reflecting the rapid use cycle in the cleanroom. We also offer vendor-managed inventory programs for high-volume customers.

Key Frequently Asked Questions about SEMI Quartz

  • Q: Why is synthetic fused silica (JGS1) often preferred in semiconductor applications over natural quartz?

    A: Synthetic fused silica is preferred because it is synthesized chemically, resulting in extremely low metallic impurity levels (critical for silicon purity) and very low OH (hydroxyl) content compared to natural fused quartz. The low OH content minimizes bubble formation and reduces the devitrification rate at high temperatures, ensuring longer component lifespan and minimal particle generation, which is non-negotiable for advanced IC manufacturing.

  • Q: What is the significance of the final acid-etch cleaning process?

    A: The acid-etch process, typically involving a mixture of hydrofluoric and nitric acids, is crucial for two reasons. First, it chemically removes metallic contaminants that might have adhered to the quartz surface during mechanical fabrication. Second, it removes micro-cracks and surface damage left by grinding, effectively smoothing the surface to a chemically passive state. This step is essential for reducing particle shedding and suppressing devitrification during high-temperature furnace cycling, directly boosting wafer yield.

  • Q: How does contamination from quartz affect wafer device performance?

    A: Contaminants, particularly alkali metals (Na,K) and transition metals (Fe,Cu), can diffuse from the quartz material into the silicon wafer during high-temperature processing. These metals act as unintended dopants or deep-level traps in the silicon lattice, leading to leakage currents, reduced carrier lifetime, and ultimately, poor device yield and functional failures (e.g., faulty transistors or reduced solar cell efficiency). Strict purity control on the quartz is therefore a direct yield driver.

  • Q: What is the recommended refurbishment cycle for quartz wafer boats?

    A: The refurbishment (re-etching and annealing) cycle depends on the process: harsh processes (e.g., Cl2​ containing CVD) require more frequent refurbishment (e.g., every 50-100 cycles) than cleaner processes (e.g., dry oxidation). Refurbishment is necessary when the boat starts showing visible devitrification (whitening) or when the wafer yield starts dropping due to increased particle generation. It is a cost-effective way to extend component life, but it can only be done a finite number of times before the component must be retired.

From Made-in-China to
Global Smart Manufacturing

Yancheng Mingyang Quartz Products Co., Ltd. is a company specializing in the production of quartz and special glass products. Yancheng Mingyang Quartz Products Co., Ltd. is the production plant of Jinzhou Mingde Quartz Glass Co., Ltd. in Jiangsu, Since its establishment, the company has developed rapidly, introduced advanced technology and production equipment at home and abroad, and continuously improved and improved product quality. Relying on its own advantages, we have developed a variety of products suitable for the market and meet the needs of different customers, and solved many urgent production problems for our customers.

The company's products include quartz glass tubes, double-hole quartz glass tubes, quartz glass rods, quartz sheets, sapphire windows, calcium fluoride glass windows, infrared ultraviolet coatings, high-pressure resistant aluminosilicate glass window panels, quartz glass instruments, high borosilicate glass instruments, quartz crucibles, quartz gold-plated tubes, quartz heaters, quartz infrared heating tubes, far-infrared directional radiation heaters ultraviolet germicidal lamps and other special types of quartz glass products.

Yancheng Mingyang Quartz Products Co., Ltd.
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